NTD24N06LG【PDF 1/8 页】MOSFET N-CH 60V 24A DPAK

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NTD24N06L, STD24N06L

Power MOSFET

24 Amps, 60 Volts

Logic Level, N ? Channel DPAK

Designed for low voltage, high speed switching applications in

power supplies, converters and power motor controls and bridge

circuits.

Features

? AEC ? Q101 Qualified and PPAP Capable ? STD24N06L

? These Devices are Pb ? Free and are RoHS Compliant

http://onsemi.com

24 AMPERES, 60 VOLTS

R DS(on) = 0.036 W ( Typ)

N ? Channel

Typical Applications

? Power Supplies

? Converters

? Power Motor Controls

? Bridge Circuits

MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)

Rating

Drain ? to ? Source Voltage

Symbol

V DSS

Value

Unit

Vdc

MARKING DIAGRAMS

& PIN ASSIGNMENTS

Drain ? to ? Gate Voltage (R GS = 10 M W )

Gate ? to ? Source Voltage

? Continuous

? Non ? repetitive (t p v 10 ms)

Drain Current

? Continuous @ T A = 25 ° C

? Continuous @ T A = 100 ° C

? Single Pulse (t p v 10 m s)

Total Power Dissipation @ T A = 25 ° C

Derate above 25 ° C

Total Power Dissipation @ T A = 25 ° C (Note 1)

Total Power Dissipation @ T A = 25 ° C (Note 2)

Operating and Storage Temperature Range

V DGR

V GS

I D

I DM

P D

T J , T stg

" 15

" 20

62.5

0.42

1.88

1.36

? 55 to

+175

Vdc

Adc

Apk

W/ ° C

° C

1 2

DPAK

CASE 369C

(Surface Mount)

STYLE 2

Gate

DPAK

Drain

Source

Single Pulse Drain ? to ? Source Avalanche

Energy ? Starting T J = 25 ° C

(V DD = 50 Vdc, V GS = 5.0 Vdc,

L = 1.0 mH, I L (pk) = 18 A, V DS = 60 Vdc)

Thermal Resistance

? Junction ? to ? Case

? Junction ? to ? Ambient (Note 1)

? Junction ? to ? Ambient (Note 2)

E AS

R q JC

R q JA

162

2.4

110

° C/W

CASE 369D

(Straight Lead)

STYLE 2

1 2 3

Gate Drain Source

Maximum Lead Temperature for Soldering T L 260 ° C

Purposes, 1/8 in from case for 10 seconds

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. When surface mounted to an FR4 board using 0.5 sq. in. pad size.

2. When surface mounted to an FR4 board using minimum recommended pad

size.

Y = Year

WW = Work Week

24N6L = Device Code

G = Pb ? Free Package

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

? Semiconductor Components Industries, LLC, 2011

October, 2011 ? Rev. 3

Publication Order Number:

NTD24N06L/D

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